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Publications

TitleAuthorEventDate
Embedded Power– Eine neue Möglichkeit zur ElektromobilitätMike Morianz
AT&S
25. FED-Conference, Berlin, Germany21.-22.09.2017
Sintering materials and processes for advanced power applications in electric vehiclesDion Manessis
TU Berling
EUROMAT 2017, “European Congress and Exhibition on advanced materials and Processes”, Thessaloniki, Greece17.-22.09.2017
Leiterplatten – Einbetttechnik (EmPower-Projekt)Hannes Stahr
AT&S
ECPE - Cluster-Seminar: Schaltungsträger und Substrattechnologien für die Leistungselektronik26.-27.06.2017
Thermal Characterisation of 500W PowermodulJohann Nicolics
TU Wien
ISSE 40th International
Spring Seminar on Electronics Technology, Sofia, Bulgaria
10.-14.05.2017
EmPowerStephanie Groß
Continental
APE 2017 Automotive Power Electronics, Paris, France26.-27.4.2017
3D Modular Power Electronic Packages and Modules for different power classes - from 50W to 50kWLars Boettcher IZM/TU BerlinIMAPS Device Packaging Conference, Fountain Hills, Arizona USA7.-9.03.2017
EmPower - das 50kW PowermodulHannes Stahr
AT&S
Bayern Innovativ, Der Beitrag der Leiterplatte zur Digitalisierung, Nurnberg Germany31.01.2017
Thermal Simulation for Embedded Power ModulesHannes Stahr
AT&S
ECPE WS- Thermal and Reliability Modelling and Simulation of Power Electronics Components and Systems, Fuerth, Germany30.11.-1.12.2016
Eingebettete Komponenten in der Leiterplatte - der wesentliche Schritt Richtung Modularisierung im letzten JahrzehntHannes Stahr
AT&S
Technology Forum AT&S, Spielberg, Austria18.-19.10.2016
Embedded Power ComponentsJohann Nicolics
TU Wien
Smart Communities and Technolgies @ TU Wien, Vienna, Austria17.10.2016
Embedded Die Power Electronic Packages and Modules for different power classes from 50W to 50kWLars Boettcher IZM/TU BerlinIMAPS France,Tours, France13.10.2016
Electronic Packages and Modules Based on Embedded Die TechnologiesLars Boettcher IZM/TU BerlinSMTA International Conference, Rosemont IL, USA25.-29.09.2016
Next Generation PCB and panel-based Packages using embedding technologiesLars Boettcher IZM/TU Berlin24. FED-Conference, Bonn, Germany15.-16.09.2016
Embedded Power Electronics on the way to be launchedMike Morianz
AT&S
24. FED-Conference, Bonn, Germany15.-16.09.2016
Thermal benchmark of a classic and novel embedded high-power 3-phase Inverter bridgeHannes Stahr
AT&S
ESCT 2016 - 6th Electronics System-Integration Technology Conference, Grenoble, France13.-15.09.2016
Thermal Performance of Novel Diode PackagesMichael Unger
TU Wien
ISSE 2016 - 39th International Spring Seminaar on Electronics Technology, Pilsen, Czech Republic18.-22.05.2016
Power Core Embedding a Plurality of IC devices and sandwiching between two isolated meatl substrates: predicted thermal stressesJohann Nicolics
TU Wien
IEEE EuroSimE 2016, Montpellier, France17.-20.04.2016
Embedded die packages and modules for power electronics applicationsLars Boettcher IZM/TU BerlinIMAPS Device Packaging Conference, Fountain Hills, Arizona USA15.-17.03.2016
Investigation of a power module with double sided cooling using a new concept for chip embeddingHannes Stahr
AT&S
CIPS 2016 - 9th Int. Conference on Integrated Power Electronic Systems, Nuremberg, Germany08.-10.03.2016
Predicted Thermal Stresses in a Bow-Free Electronic Assembly
for Automotive and Potential Aerospace Applications
Johann Nicolics
TU Wien
IEEE Aerospace Conference
Big Sky,Montana
05.-12.03.2016
EmPower- Integrierte Leistungskomponenten für ElektrofahrzeugeStephanie Groß
Continental
EBL 2016 - Elektronische Baugruppen und Leiterplatten, Felbach, Germany16.-17.02.2016
Entwicklung von innovativen leistungselektronischen
Gehäusen und Modulen mit
eingebetteten Halbleitern
Lars Boettcher IZM/TU Berlin12. Kooperationsforum mit Fachausstellung
Die Leiterplatte als Integrationsmodul in der Automobil-, Industrie- und Medizinelektronik , Nürnberg, Germany
26.01.2016
Project EmPower
Embedded power components for electric vehicle applications
Michael Guggemos
ATOTECH
BMBF - Schlüsseltechnologien für die Elektromobilität
Bonn, Germany
23.11.2015
Development of Advanced Embedded Die Packages and Modules for Power Electronics ApplicationsLars Boettcher IZM/TU BerlinSMTA International Conference
Chicago IL, USA
27.9.-1.10.2015
PCB and Panel-Based Packaging Using Embedded Die TechnologiesLars Boettcher IZM/TU BerlinTechsearch Workshop: Panel Processing – Filling the Gap Between Frontend and PCB, Fraunhofer EMFT, Munich, Germany09.11.2015
Integration of electric components into PCB for electromobility applicationsStephanie Groß
Continental
EDPC - Electric Drives Production Conference and Exhibition15.-16.09.2015
Development of Advanced Power Modules for Electric Vehicle ApplicationsLars Boettcher IZM/TU BerlinIMAPS - EMPC 2015 - 20th European Microelectronics and Packaging Conference & Exibition, Friedrichshafen, Germany13.-16.09.2015
EmPower - Milestone to Power ElectronicsMike Morianz
AT&S
IMAPS - EMPC 2015 - 20th European Microelectronics and Packaging Conference & Exibition, Friedrichshafen, Germany13.-16.09.2015
Embedded Power Electronics on the way to be launchedMike Morianz
AT&S
EIPC Summer Conference
Berlin, Germany
18.-19.06.2015
Thermomechanical comparison of novel embedded high power package using FEM-simulationsMichael Unger
TU Wien
IMAPS - Nordic - The IMAPS Nordic Conference 2015
Helsingor, Denmark
08.-09.06.2015
Embedding of Power Semiconductors for Innovative Packages and ModulesLars Boettcher IZM/TU BerlinAPE-Congress on Automotive Power Electronics,
Paris, France
15.-17.04.2015
Embedded Power Modules – A new approach using Power Core and High Power PCBLars Boettcher IZM/TU Berlin11th International Conference and Exhibition on Device packaging (DPC)17.03.2015

Press Releases

TitleDownloads
Innovatives Power Packaging 30/05/2017Elektronik 11/2017
An innovative plating system for next generation packaging technologies 24/01/2016Silicon Semiconductor Vol38 Issue 1/2016
Systemgrenzen werden sich verschieben
AT&S Partner in EmPower-Consortium 10/12/2015
Markt & Technik 49
Press Release 22/12/2014Download AT&S Press Release 12/2014
Press Release 06/12/2013Download AT&S Press Release 12/2013
Press Release 10/2013Download Atotech Press Release 10/2013